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AMD Ryzen 7000: Everything we know about Zen 4 CPUs

AMD kicked off 2022 with its new Ryzen 6000 mobile CPUs and its current-generation gaming king, the Ryzen 5800X3D. But the true next-gen AMD processors are coming later this year, with a new Zen 4 architecture, a new 5nm process node, higher clock speeds than ever before, and a massively expanded feature and supported hardware list. AMD’s Ryzen 7000 processors should be the most important CPUs AMD has released since the first-generation Ryzen chips in 2017.

Here’s everything we know about Ryzen 7000 so far.

Pricing and availability

AMD confirmed at Computex 2022 that its Ryzen 7000 CPUs and AM5 motherboards would launch in fall 2022, putting it somewhere between September and November. That’s a little later than some hoped for, but suggests that the original Q3 predictions were more late-Q3 than early.

Pricing is still up in the air but is likely to be similar to its existing range of Ryzen 5000 processors, which retained their launch price tags for most of their lifecycle, only dropping after the launch of Intel’s hotly-competitive Alder Lake processors.

For reference, here are the prices of Ryzen 5000 chips at the time of writing:

  • Ryzen 5 5600X: $200
  • Ryzen 7 5700X: $299
  • Ryzen 7 5800X: $310
  • Ryzen 7 5800X3D: $450
  • Ryzen 9 5900X: $396
  • Ryzen 9 5950X: $535

These are significantly lower than they were when the chips first launched, however, and have been discounted ahead of Zen 4’s launch, so expect prices to be close to 50% higher when Zen 4 debuts.

Architecture

Zen 4 architecture slide.

The Ryzen 7000 chips are based on the new Zen 4 architecture. This is a continuation of the Zen microarchitecture that AMD has been using since Ryzen 1000, but it continues the evolution of the chiplet design pioneered on Zen 2 and is built on TSMC’s new enhanced 5nm process node.

The 5nm node — known as N5 at TSMC — is said to offer a 15% boost in speed and 1.8x transistor density over N7, helping the node consume 30% less power for improved performance and efficiency. However, the company clarified and gave more information during its Financial Analyst Day 2022 about the upcoming Ryzen 7000 processors. Expect the next-gen processors to offer an 8% to 10% increase in instruction per clock (IPC), over 25% performance per watt, and over 35% overall performance improvement compared to the previous generation. It will also feature up to 25% more memory bandwidth per core, as well as support for 3D V-Cache, although it will be limited to select processors in the lineup.

AMD's Ryzen roadmap through 2024.

AMD had earlier confirmed a maximum TDP of 170W on its new-generation chips, with major changes to their design. Each 5nm chiplet will have up to eight cores, with a doubled L2 cache of 1MB per core. Each die will also feature a new 6nm I/O die with onboard Radeon RDNA 2 graphics and AI acceleration.

AMD also announced that it will be moving to the 4nm process node in 2024 when it launches the Zen 5 architecture for desktops while Threadripper processors built on Zen 4 are also in the works

Performance

Lisa Su showing Zen 4 CPU.

We still don’t have robust numbers on just how well AM4 CPUs perform, but the details are starting to come out, even if we need to view them through a skeptical eye.

AMD claims that the new CPUs will enjoy a more than 15% increase in single-threaded performance, which if it can be extrapolated across multiple cores at once, would see Zen 4 CPUs enjoy an enormous performance advantage over both Zen 3, and Intel’s 12th-generation Alder Lake processors. As mentioned above, the only additional performance numbers that we have on our hand is the increase in instruction per clock (IPC) by 8% to 10%  alongside 25% improvement in performance-per-watt, and over 35% overall performance improvement compared to Ryzen 5000 desktop processors.

That improved performance comes from the process and architecture efficiency improvements, as well as a huge uplift in frequency. At Computex 2022 AMD showed a recorded game of Ghostwire Tokyo running on a Zen 4 CPU at up to 5.52 GHz, though the frequency did bounce around between there and a more modest 5.3GHz. That’s a huge increase over the claimed 4.9GHz the 5950X is capable of, and more again over its typical real-world frequencies which were lower in games.

Managing these kinds of frequencies at a maximum TDP of just 170W would be a serious win for AMD, because not only should it mean world-beating gaming performance, but doing so at a power draw vastly lower than the flagship Intel Alder Lake CPUs. This doesn’t mean it won’t have stiffer competition from the upcoming Raptor Lake CPUs, but it bodes well for AMD’s launch that pre-production chips can already hit such high frequencies.

AMD Ryzen 7000 benchmark in Blender.

Outside of gaming, AMD is claiming big improvements in multi-threaded performance in productivity software too. In a demo at Computex, it showed an unnamed 16-core Ryzen 7000 CPU going head to head with Intel’s 12900K in Blender. It managed to complete the short run up to 31% faster than the Intel CPU.

Another feature that should help boost performance is support for DDR5 memory. In AMD’s Computex test notes it claimed to be running a kit of DDR5 6000MHz memory, which is significantly higher than the 4800MHz memory officially supported by Intel’s 12th gen CPUs.

Ryzen 7000 processors exclusively support DDR5 memory, which is more expensive than DDR4. However, AMD seems confident that Ryzen 7000 could bring DDR5 prices down.

New chipset and a new socket

AM5 socket shown at CES 2022.
AMD

With the next generation of CPUs, AMD is retiring the AM4 socket that it has used since the launch of first-generation Ryzen chips. That shouldn’t come as a surprise, as the socket will be some five years old by the time next-gen Ryzen chips show up.

This new socket will use an LGA1718, Land Grid Array design, with the CPU pins on the motherboard instead of on the CPU. Intel has used LGA sockets for several generations, while AMD has stuck with the older Pin Grid Array (PGA) socket design for everything up to Ryzen 5000.

As the name suggests, LGA1718 will feature 1,718 pins on the motherboard. LGA designs can support a higher pin density, and that’s clear to see with AM4’s mere 1,331 pins. Those additional pins will help open up support for DDR5 memory, as well as PCI-Express 5.0, and improved overall performance.

Those new AM5 sockets will be part of a new generation of 600 series motherboards. The X670E extreme motherboards will offer the highest quality VRMs for enhanced overclocking, and will have PCI-E 5 support on every M2 and PCI-E slot; X670 boards will feature mainstream overclocking potential, PCI-E 5 on both the first x16 PCI-Express slot, and at least one M.2 slot, while B650 motherboards will have PCI-E 5 for at least one M.2 slot, and will instead feature PCI-E 4 for the PCI-Express slots.

These new motherboards will bring with them support for up to 24 PCI-E 5 lanes, 14 USB ports running up to 20 Gbps, Wi-Fi 6E, and Bluetooth 5.2. Better yet, thanks to the new integrated graphics AMD 600 motherboards will be able to support up to four HDMI 2.1 or DisplayPort 2 ports.

Although AMD is moving to a new socket design, Ryzen 7000 chips will use the same socket size and will fully support AM4 coolers.

Integrated graphics and APUs

The AMD RX 6700 XT sitting on a table.

By including the GPU on the I/O die instead of the main CPU chiplets, AMD isn’t having to make any sacrifices to add integrated graphics, so all Ryzen 7000 chips will have an onboard RDNA 2 GPU. Ryzen 7000 won’t replace APUs, though. Instead, the included graphics are meant to aid in troubleshooting.

RDNA 2 is the same architecture AMD is currently using on its Radeon RX 6000 graphics cards, as well as the Xbox Series X and PlayStation 5, and the new Ryzen 6000 mobile CPUs, so that should give these chips excellent entry-level gaming capabilities, even when they aren’t paired with a dedicated graphics card.

This is not only great for anyone who doesn’t want to buy a new GPU, but it’s great for troubleshooting GPU issues. Speaking of which, there is also some new information regarding the upcoming Radeon RX 7000 GPUs where AMD has confirmed that it will be based on the 5nm manufacturing process and will deliver more than a 50% improvement in performance per watt over the previous generation.

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AMD Zen 4D Could Use Hybrid Design to Rival Intel Alder Lake

YouTuber and leaker Moore’s Law is Dead revealed new information regarding AMD’s future architecture plans. According to leaks, AMD is working on a “dense” version of Zen 4 called Zen 4D. Zen 4D is basically a fork of Zen 4 that strips out features and reduces clock speeds.

It will also feature a newly designed cache system. All of this is to slightly reduce single-core performance in exchange for greatly increased multi-core performance. This would also allow AMD to increase the chip density, hence the “D” in the name.

If the leaks are true, it seems the company may be creating its own hybrid architecture to compete with the success of Intel’s 12th-gen Alder Lake chips. This follows in the footsteps of both Intel and Apple, who have utilized similar architectures in their respective CPU designs.

These Zen 4D processors would have about half the L3 cache of regular Zen 4 and feature 16 cores per chiplet. Moore’s Law is Dead stated that Zen 4D is expected to have simultaneous multithreading (SMT), but they couldn’t be 100% certain. He was also uncertain if Zen 4D would support AVX-512 but did confirm that Bergamo, AMD’s 128-core server-grade EPYC CPU slated for second quarter 2023, would feature the new architecture.

The new architecture for Zen 5 was also leaked, and this is by far the most interesting news. The leaks suggest that Zen 5 will be AMD’s first hybrid processor architecture. It would use eight Zen 5 “big” cores and up to 16 Zen 4D “little” cores. Zen 5 is also rumored to be codenamed Granite Ridge and based on the Ryzen 8000 series processors built on TSMC’s ridiculously tiny 3nm process.

As we’ve seen with Intel’s Alder Lake chips and Apple’s M1 Pro/Max CPUs, the hybrid approach can offer huge performance increases. It makes sense that AMD would architecture their chips in a similar manner, as Zen 5 could offer a 20-25% IPC increase over Zen 4. The problem is that Zen 5 is still a few years out, and Alder Lake currently outperforms AMD’s best consumer chips.

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Everything AMD’s New AM5 Socket Reveals About Zen 4

The next generation of AMD Zen 4 processors, code-named AMD Ryzen Raphael, is on the horizon. While the launch is still far away, ExecutableFix on Twitter already revealed renders of what the AM5 CPU socket is likely going to look like.

The renders show that the AM5 socket resembles Intel’s mainstream LGA socket rather closely. They also tell us more about the architecture used in the upcoming AMD CPUs.

Zen 4 Raphael are going to be desktop processors that will bring a vast array of new features. Leaks suggest that switching to the AM5 socket will allow AMD to deliver the biggest platform upgrade in several years. Zen 4 is going to be the direct replacement to AMD’s current mainstream line of processors, the Zen 3, which were code-named Vermeer.

Previous leaks suggested that Zen 4 Raphael processors will be based on a 5nm core architecture combined with 6nm input/output (I/O) dies. The new AMD AM5 will carry the latest LGA 1718 socket which was created to support the latest gen of Ryzen-based desktops. It’s exactly this socket that ExecutableFix has posted renders of, revealing more about the chip. 

Based on the look of the AM5 socket alone, we can surmise that the retention design for LGA 1718 is very similar to the current Intel Core CPU sockets. The socket no longer features pins underneath the processor, making it a safer option than the previous gen. The pins will now instead be positioned inside the socket itself, allowing for contact with the LGA pads that are placed under the CPU. AM5 has a single latch and land grid array packaging.

The images posted on Twitter show that AMD Ryzen Raphael processors will be square-shaped and will measure 45x45mm. Inside, the CPUs will house an unexpectedly large integrated heat spreader (IHS). The size of the IHS implies that AMD may be trying to balance the temperatures and thermal load across several chiplets. Much like the rest of the socket, the IHS resembles Intel solutions in its design, namely the Intel Core-X HEDT line of CPUs.

As we only have renders to go on right now, some of the design choices are pure guesswork at this point. The two partitions on each side of the socket could be cut-outs, but they could also just be reflections from the render.

If they are indeed cut-outs, it’s possible that AMD designed the socket to vent air out of it. That could have some repercussions, such as the air being trapped in the central chamber or blown into the VRMs of the motherboard. We will have to wait and see how AMD addresses this potential issue.

Render of an AMD Zen 4 processor.

The switch to Zen 4 architecture should bring a host of improvements and exciting changes. Rumors point to the new Zen 4 architecture bringing up to 25% instructions per clock (IPC) gain over Zen 3 as well as a 5GHz clock speed. AMD has previously hinted that it hopes to increase the number of cores found in mainstream processors. This suggests an upgrade over the current 16 cores and 32 threads. 

According to Dr. Lisa Su, the CEO of AMD, “We are focusing on Zen 4 and Zen 5 to be extremely competitive. There will be more core counts in the future – I would not say those are the limits! It will come as we scale the rest of the system.”

Some of the other likely upgrades include DDR5 memory support with base clock speeds starting at 4,800MHz and going up to 10,000MHz, PCIe 5.0 compatibility, and RDNA 2 onboard graphics. 

The launch of AMD Zen 4 Raphael is still a long way away — the CPUs are likely to hit the shelves in late 2022. This means that many features may still change. One thing seems fairly certain for now — AMD is working on Zen 4 to be a powerful lineup of CPUs capable of competing against Intel’s 13th-generation Raptor Lake processors.

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Ryzen 4000 CPUs explained: How AMD optimized Zen 2 for laptops

AMD’s highly anticipated Ryzen 4000 mobile CPUs may be built on the same 7nm process as the company’s wildly successfully Ryzen 3000 chips, but this time around the company is pinning the chip’s success on a carefully balanced design.

AMD officials said they’ve actually been working on the design for Ryzen 4000 mobile (code-named ‘Renoir’) since 2017, which, they note, predates the introduction of the company’s first Ryzen desktop chips.

The goal for the mobile chip couldn’t be more different. “The challenge in doing a notebook processor is balance: How do we balance the attributes that make it a good notebook processor?” said Dan Bouvier, AMD’s client products chief architect.

A laptop chip can’t go all-out like a desktop chip can. It has to consider the notebook chassis, the Z-height (thickness), the power envelope, and the battery life. “These are all opposing things that work against bringing higher performance,” Bouvier explained, “but you still want to balance that and bring the best performance.”

amd ryzen 4000 zen 2 2 AMD

Most of the architectural changes with Zen 2 are well known, but its 15-percent increase in Instructions Per Clock (IPC)  have made the Zen 2 the hit it is.

Bouvier added that AMD took a risk by stretching Renoir’s design beyond that of its quad-core predecessor. “When we started Renoir, we said, ‘let’s do quad-core, we’ll just make it faster.’” But Bouvier said AMD realized even more was possible so it aimed for a 6-core CPU. And once those models came back, AMD aimed even higher. “We started looking at the models and said, this is looking pretty good—let’s go further. So we did go eight cores, and we really went out on a limb.”

And remember, Bouvier pointed out: In 2017, competitor Intel was still selling a dual-core CPU.

amd ryzen 4000 zen 2 AMD

Two 4-core CCXs are used to build the basic Ryzen 4000 CPUs today.

The Ryzen 4000 CPU’s basic building block is essentially the same 7nm Zen 2 core AMD has used with its Ryzen 3000 series and third-generation Threadripper CPUs, but optimized for mobile. The basic building block of a mobile Ryzen is built on quad-core core complexes, or “CCX.” Each CCX features four cores with SMT and 512MB of L2 cache, plus a 1MB Level 3 cache that’s shared among all four cores. Two of the CCXs make up an 8-core chip.

You might expect AMD to use a single cluster for power efficiency needs. Bouvier described it as a “tradeoff,” but noted that the multi-CCX still enables very high bandwidth, very high frequency, and better power performance.

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